POWER DEVICE MODULE WITH DUMMY PAD DIE LAYOUT

POWER DEVICE MODULE WITH DUMMY PAD DIE LAYOUT

A semiconductor die includes an electronic device formed in the semiconductor die. The semiconductor die further includes a plurality of device contact pads disposed on a surface of the semiconductor die. The plurality of device contact pads are electrically connected to the electronic device. The p...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TEYSSEYRE, Jerome, LIN, Yusheng, CHEN, Huibin
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor die includes an electronic device formed in the semiconductor die. The semiconductor die further includes a plurality of device contact pads disposed on a surface of the semiconductor die. The plurality of device contact pads are electrically connected to the electronic device. The plurality of device contact pads include at least an emitter contact pad and a signal sense contact pad, and a dummy device contact pad disposed on the surface of the semiconductor die. The dummy device contact pad provides an area for a solder joint between the semiconductor die and a substrate in addition to an area provided by the plurality of device contact pads.