METHOD FOR MANUFACTURING ELECTRONIC CONSTRUCTIVE OBJECT AND ELECTRONIC CONSTRUCTIVE OBJECT THEREOF

The method plans a predetermined circuit pattern on an inner surface of a constructive object and plans a contact portion on an outer surface of the constructive object for external electric connection. Laser is used to scan an area in which both the circuit pattern and the contact portion are locat...

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Hauptverfasser:	Chang, Kun-Chuan, Lin, Chih-Hung, Tsao, Keng-Yu, Sung, Yu-Hsuan
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING LIGHTING MECHANICAL ENGINEERING STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS
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creator	Chang, Kun-Chuan Lin, Chih-Hung Tsao, Keng-Yu Sung, Yu-Hsuan
description	The method plans a predetermined circuit pattern on an inner surface of a constructive object and plans a contact portion on an outer surface of the constructive object for external electric connection. Laser is used to scan an area in which both the circuit pattern and the contact portion are located. A through hole is formed to make both the circuit pattern and the contact portion uninsulated and to form an irregular roughened surface on the area scanned by heat of the laser. A layer of conductive material is deposited on the roughened surface by a mixture of a catalyst solution and metal powder. The constructive object is immersed in a reaction tank to implement electroless plating to gradually thicken the layer of conductive material to become a conductor. The conductor penetrating the through hole makes the circuit pattern and the contact portion electrically connected.
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fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024219012A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024219012A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024219012A13</originalsourceid><addsrcrecordid>eNrjZEjydQ3x8HdRcPMPUvB19At1c3QOCQ3y9HNXcPVxdQ4J8vfzdFZw9vcLDgkKdQ7xDHNV8HfyAkooOPq5EFIS4uEa5OrvxsPAmpaYU5zKC6W5GZTdXEOcPXRTC_LjU4sLEpNT81JL4kODjQyMTIwMLQ0MjRwNjYlTBQD72zVX</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR MANUFACTURING ELECTRONIC CONSTRUCTIVE OBJECT AND ELECTRONIC CONSTRUCTIVE OBJECT THEREOF</title><source>esp@cenet</source><creator>Chang, Kun-Chuan ; Lin, Chih-Hung ; Tsao, Keng-Yu ; Sung, Yu-Hsuan</creator><creatorcontrib>Chang, Kun-Chuan ; Lin, Chih-Hung ; Tsao, Keng-Yu ; Sung, Yu-Hsuan</creatorcontrib><description>The method plans a predetermined circuit pattern on an inner surface of a constructive object and plans a contact portion on an outer surface of the constructive object for external electric connection. Laser is used to scan an area in which both the circuit pattern and the contact portion are located. A through hole is formed to make both the circuit pattern and the contact portion uninsulated and to form an irregular roughened surface on the area scanned by heat of the laser. A layer of conductive material is deposited on the roughened surface by a mixture of a catalyst solution and metal powder. The constructive object is immersed in a reaction tank to implement electroless plating to gradually thicken the layer of conductive material to become a conductor. The conductor penetrating the through hole makes the circuit pattern and the contact portion electrically connected.</description><language>eng</language><subject>BLASTING ; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF ; HEATING ; LIGHTING ; MECHANICAL ENGINEERING ; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR ; WEAPONS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240704&DB=EPODOC&CC=US&NR=2024219012A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240704&DB=EPODOC&CC=US&NR=2024219012A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Chang, Kun-Chuan</creatorcontrib><creatorcontrib>Lin, Chih-Hung</creatorcontrib><creatorcontrib>Tsao, Keng-Yu</creatorcontrib><creatorcontrib>Sung, Yu-Hsuan</creatorcontrib><title>METHOD FOR MANUFACTURING ELECTRONIC CONSTRUCTIVE OBJECT AND ELECTRONIC CONSTRUCTIVE OBJECT THEREOF</title><description>The method plans a predetermined circuit pattern on an inner surface of a constructive object and plans a contact portion on an outer surface of the constructive object for external electric connection. Laser is used to scan an area in which both the circuit pattern and the contact portion are located. A through hole is formed to make both the circuit pattern and the contact portion uninsulated and to form an irregular roughened surface on the area scanned by heat of the laser. A layer of conductive material is deposited on the roughened surface by a mixture of a catalyst solution and metal powder. The constructive object is immersed in a reaction tank to implement electroless plating to gradually thicken the layer of conductive material to become a conductor. The conductor penetrating the through hole makes the circuit pattern and the contact portion electrically connected.</description><subject>BLASTING</subject><subject>FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEjydQ3x8HdRcPMPUvB19At1c3QOCQ3y9HNXcPVxdQ4J8vfzdFZw9vcLDgkKdQ7xDHNV8HfyAkooOPq5EFIS4uEa5OrvxsPAmpaYU5zKC6W5GZTdXEOcPXRTC_LjU4sLEpNT81JL4kODjQyMTIwMLQ0MjRwNjYlTBQD72zVX</recordid><startdate>20240704</startdate><enddate>20240704</enddate><creator>Chang, Kun-Chuan</creator><creator>Lin, Chih-Hung</creator><creator>Tsao, Keng-Yu</creator><creator>Sung, Yu-Hsuan</creator><scope>EVB</scope></search><sort><creationdate>20240704</creationdate><title>METHOD FOR MANUFACTURING ELECTRONIC CONSTRUCTIVE OBJECT AND ELECTRONIC CONSTRUCTIVE OBJECT THEREOF</title><author>Chang, Kun-Chuan ; Lin, Chih-Hung ; Tsao, Keng-Yu ; Sung, Yu-Hsuan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024219012A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BLASTING</topic><topic>FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>Chang, Kun-Chuan</creatorcontrib><creatorcontrib>Lin, Chih-Hung</creatorcontrib><creatorcontrib>Tsao, Keng-Yu</creatorcontrib><creatorcontrib>Sung, Yu-Hsuan</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Chang, Kun-Chuan</au><au>Lin, Chih-Hung</au><au>Tsao, Keng-Yu</au><au>Sung, Yu-Hsuan</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR MANUFACTURING ELECTRONIC CONSTRUCTIVE OBJECT AND ELECTRONIC CONSTRUCTIVE OBJECT THEREOF</title><date>2024-07-04</date><risdate>2024</risdate><abstract>The method plans a predetermined circuit pattern on an inner surface of a constructive object and plans a contact portion on an outer surface of the constructive object for external electric connection. Laser is used to scan an area in which both the circuit pattern and the contact portion are located. A through hole is formed to make both the circuit pattern and the contact portion uninsulated and to form an irregular roughened surface on the area scanned by heat of the laser. A layer of conductive material is deposited on the roughened surface by a mixture of a catalyst solution and metal powder. The constructive object is immersed in a reaction tank to implement electroless plating to gradually thicken the layer of conductive material to become a conductor. The conductor penetrating the through hole makes the circuit pattern and the contact portion electrically connected.</abstract><oa>free_for_read</oa></addata></record>
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language	eng
recordid	cdi_epo_espacenet_US2024219012A1
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subjects	BLASTING FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING LIGHTING MECHANICAL ENGINEERING STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS
title	METHOD FOR MANUFACTURING ELECTRONIC CONSTRUCTIVE OBJECT AND ELECTRONIC CONSTRUCTIVE OBJECT THEREOF
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T10%3A54%3A31IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Chang,%20Kun-Chuan&rft.date=2024-07-04&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024219012A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true