METHOD FOR MANUFACTURING ELECTRONIC CONSTRUCTIVE OBJECT AND ELECTRONIC CONSTRUCTIVE OBJECT THEREOF

The method plans a predetermined circuit pattern on an inner surface of a constructive object and plans a contact portion on an outer surface of the constructive object for external electric connection. Laser is used to scan an area in which both the circuit pattern and the contact portion are located. A through hole is formed to make both the circuit pattern and the contact portion uninsulated and to form an irregular roughened surface on the area scanned by heat of the laser. A layer of conductive material is deposited on the roughened surface by a mixture of a catalyst solution and metal powder. The constructive object is immersed in a reaction tank to implement electroless plating to gradually thicken the layer of conductive material to become a conductor. The conductor penetrating the through hole makes the circuit pattern and the contact portion electrically connected.