SACRIFICIAL GLUE COMPOSITION

A sacrificial glue composition comprises: a water-soluble resin, accounting for 18-40 wt % of the sacrificial glue composition; a low melting point compound, having a melting point of 90-180° C., and accounting for 2-20 wt % of the sacrificial glue composition; a foaming agent, accounting for 20-40...

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Bibliographische Detailangaben
Hauptverfasser:	HUANG, YING-HUA, PAI, YUING, WANG, HUNGIN
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A sacrificial glue composition comprises: a water-soluble resin, accounting for 18-40 wt % of the sacrificial glue composition; a low melting point compound, having a melting point of 90-180° C., and accounting for 2-20 wt % of the sacrificial glue composition; a foaming agent, accounting for 20-40 wt % of the sacrificial glue composition; and a residue of solvent. By the sacrificial glue composition, the problems of subsequent poor electroplating process and poor soldering of mounting on board caused by the unclean surface of the protective glue adhered on an end surface of an electronic part can be avoided, and the process efficiency and production capacity can be improved. Further, by the sacrificial glue composition, a simple mechanical force can be used to carry out rolling brushing the end surface of the passive element in the subsequent washing process, the protective glue causing the unclean surface can be removed.