PLATING PROCESS METHOD

Provided is a technique that ensures suppressing deterioration of a plating quality of a substrate caused by gas bubbles accumulating on an entire lower surface of a membrane.A plating process method includes a step of guiding an anode liquid to a second region R2 positioned below a membrane 40 and...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MASUDA, Yasuyuki, TOMITA, Masaki
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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