PLATING PROCESS METHOD

PLATING PROCESS METHOD

Provided is a technique that ensures suppressing deterioration of a plating quality of a substrate caused by gas bubbles accumulating on an entire lower surface of a membrane.A plating process method includes a step of guiding an anode liquid to a second region R2 positioned below a membrane 40 and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MASUDA, Yasuyuki, TOMITA, Masaki
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:Provided is a technique that ensures suppressing deterioration of a plating quality of a substrate caused by gas bubbles accumulating on an entire lower surface of a membrane.A plating process method includes a step of guiding an anode liquid to a second region R2 positioned below a membrane 40 and above a first region R1 to decrease a concentration of gas bubbles contained in the anode liquid in the second region below a concentration of gas bubbles contained in the anode liquid in the first region; a step of discharging the anode liquid from the first region; a step of discharging the anode liquid from the second region; a step of supplying a cathode liquid to a cathode chamber 12 in which a substrate Wf is disposed; and a step of flowing electricity between the substrate Wf and an anode 13 to electroplate a metal on the substrate.