PLATING APPARATUS

An occurrence of a varied power feeding to a contact member is suppressed.A substrate holder includes: a frame-shaped supporting mechanism configured to be suspended and held by a plurality of support pillars and to support an outer peripheral portion of a surface to be plated of a substrate; a back plate assembly configured to be arranged on a back surface side of the surface to be plated of the substrate and to sandwich the substrate with the supporting mechanism; a contact member 468 arranged on the supporting mechanism; and a plurality of power source line members 461. The contact member 468 has a power feeding contact point in contact with the outer peripheral portion of the surface to be plated of the substrate and a plurality of power source connecting portions 469b connected to a power source. The plurality of power source line members 461 are connected from the power source to the plurality of power source connecting portions 469b through the plurality of support pillars, and are routed such that distances from the power source to the plurality of power source connecting portions 469b become equal.