HEATER APPARATUS-INTEGRATED TOP COVER FOR A COMPUTING DEVICE

HEATER APPARATUS-INTEGRATED TOP COVER FOR A COMPUTING DEVICE

A method for heating hardware components in a computing device includes: determining a heating condition of the computing device; and in response to determination, initiating heating of a hardware component of the computing device using a heater component, in which the heater component is affixed to...

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Hauptverfasser: Tunks, Eric Michael, Nikazm, Ayedin, Vivio, Joseph Andrew
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator Tunks, Eric Michael
Nikazm, Ayedin
Vivio, Joseph Andrew
description A method for heating hardware components in a computing device includes: determining a heating condition of the computing device; and in response to determination, initiating heating of a hardware component of the computing device using a heater component, in which the heater component is affixed to a top cover of the computing device.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024206106A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024206106A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024206106A13</originalsourceid><addsrcrecordid>eNrjZLDxcHUMcQ1ScAwIcAxyDAkN1vX0C3F1BzJdXRRC_AMUnP3DgNJu_kAlQLZvQGiIp5-7gotrmKezKw8Da1piTnEqL5TmZlB2cw1x9tBNLciPTy0uSExOzUstiQ8NNjIwMjEyMDM0MHM0NCZOFQCpSypj</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HEATER APPARATUS-INTEGRATED TOP COVER FOR A COMPUTING DEVICE</title><source>esp@cenet</source><creator>Tunks, Eric Michael ; Nikazm, Ayedin ; Vivio, Joseph Andrew</creator><creatorcontrib>Tunks, Eric Michael ; Nikazm, Ayedin ; Vivio, Joseph Andrew</creatorcontrib><description>A method for heating hardware components in a computing device includes: determining a heating condition of the computing device; and in response to determination, initiating heating of a hardware component of the computing device using a heater component, in which the heater component is affixed to a top cover of the computing device.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240620&amp;DB=EPODOC&amp;CC=US&amp;NR=2024206106A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240620&amp;DB=EPODOC&amp;CC=US&amp;NR=2024206106A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Tunks, Eric Michael</creatorcontrib><creatorcontrib>Nikazm, Ayedin</creatorcontrib><creatorcontrib>Vivio, Joseph Andrew</creatorcontrib><title>HEATER APPARATUS-INTEGRATED TOP COVER FOR A COMPUTING DEVICE</title><description>A method for heating hardware components in a computing device includes: determining a heating condition of the computing device; and in response to determination, initiating heating of a hardware component of the computing device using a heater component, in which the heater component is affixed to a top cover of the computing device.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDxcHUMcQ1ScAwIcAxyDAkN1vX0C3F1BzJdXRRC_AMUnP3DgNJu_kAlQLZvQGiIp5-7gotrmKezKw8Da1piTnEqL5TmZlB2cw1x9tBNLciPTy0uSExOzUstiQ8NNjIwMjEyMDM0MHM0NCZOFQCpSypj</recordid><startdate>20240620</startdate><enddate>20240620</enddate><creator>Tunks, Eric Michael</creator><creator>Nikazm, Ayedin</creator><creator>Vivio, Joseph Andrew</creator><scope>EVB</scope></search><sort><creationdate>20240620</creationdate><title>HEATER APPARATUS-INTEGRATED TOP COVER FOR A COMPUTING DEVICE</title><author>Tunks, Eric Michael ; Nikazm, Ayedin ; Vivio, Joseph Andrew</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024206106A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Tunks, Eric Michael</creatorcontrib><creatorcontrib>Nikazm, Ayedin</creatorcontrib><creatorcontrib>Vivio, Joseph Andrew</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Tunks, Eric Michael</au><au>Nikazm, Ayedin</au><au>Vivio, Joseph Andrew</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEATER APPARATUS-INTEGRATED TOP COVER FOR A COMPUTING DEVICE</title><date>2024-06-20</date><risdate>2024</risdate><abstract>A method for heating hardware components in a computing device includes: determining a heating condition of the computing device; and in response to determination, initiating heating of a hardware component of the computing device using a heater component, in which the heater component is affixed to a top cover of the computing device.</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title HEATER APPARATUS-INTEGRATED TOP COVER FOR A COMPUTING DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-05T07%3A34%3A39IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Tunks,%20Eric%20Michael&rft.date=2024-06-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024206106A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true