HEATER APPARATUS-INTEGRATED TOP COVER FOR A COMPUTING DEVICE

A method for heating hardware components in a computing device includes: determining a heating condition of the computing device; and in response to determination, initiating heating of a hardware component of the computing device using a heater component, in which the heater component is affixed to...

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Bibliographische Detailangaben
Hauptverfasser:	Tunks, Eric Michael, Nikazm, Ayedin, Vivio, Joseph Andrew
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A method for heating hardware components in a computing device includes: determining a heating condition of the computing device; and in response to determination, initiating heating of a hardware component of the computing device using a heater component, in which the heater component is affixed to a top cover of the computing device.