SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD

A semiconductor chip includes a semiconductor substrate having an active surface and an inactive surface opposite the active surface. A semiconductor device layer is disposed on the active surface. A modified region is positioned on an entirety of a lateral side surface of the semiconductor substrat...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KANG, Unbyoung, HEO, Junyeong, LEE, Sera, JUNG, Jihoon
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor chip includes a semiconductor substrate having an active surface and an inactive surface opposite the active surface. A semiconductor device layer is disposed on the active surface. A modified region is positioned on an entirety of a lateral side surface of the semiconductor substrate.