SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

According to one embodiment, a semiconductor device includes a wiring substrate with a first conductor portion and a second conductor portion on a first surface. A protective film is on the first surface of the wiring substrate. The protective film has a first opening exposing the first conductor po...

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Bibliographische Detailangaben
Hauptverfasser:	TAKAKU, Satoru, TSUKIYAMA, Satoshi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	According to one embodiment, a semiconductor device includes a wiring substrate with a first conductor portion and a second conductor portion on a first surface. A protective film is on the first surface of the wiring substrate. The protective film has a first opening exposing the first conductor portion and a second opening exposing the second conductor portion. A first electronic component is mounted to the wiring substrate. An electrode terminal of the first electronic component is connected to the first conductor portion through the first opening. A second electronic component is stacked on the first electronic component via an adhesive layer. A first resin layer is between the protective film and the first electronic component. A second resin layer is between the protective film and the adhesive layer, the second resin layer being outside the first electronic component in a plan view.