SEMICONDUCTOR MEMORY DEVICE
According to one embodiment, a semiconductor memory device includes a stacked body including a first and second stacked portions including first and second conductive layers and having first and second end portions stepwise processed, a first and second interlayer insulating layers covering the firs...
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Zusammenfassung: | According to one embodiment, a semiconductor memory device includes a stacked body including a first and second stacked portions including first and second conductive layers and having first and second end portions stepwise processed, a first and second interlayer insulating layers covering the first and second end portions, a first stopper insulating layer provided at least between the first and second interlayer insulating layers and above the first end portion, including a first portion extending flat above the first end portion, and first contacts penetrating the second interlayer insulating layer, the first portion of the first stopper insulating layer and the first interlayer insulating layer, and connected to different first conductive layers. |
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