SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING SYSTEM INCLUDING THE SAME

There are provided a substrate treating apparatus and method for etch rate deviation improvement. The substrate treating apparatus includes: a treating bath providing space for receiving a substrate treating solution for treating substrates; a treating solution source providing the substrate treatin...

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Bibliographische Detailangaben
Hauptverfasser:	CHOI, Jun Young, LEE, Eun Jung, YOUN, Hee Jun, JANG, Young Jin, PARK, Gui Su
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	There are provided a substrate treating apparatus and method for etch rate deviation improvement. The substrate treating apparatus includes: a treating bath providing space for receiving a substrate treating solution for treating substrates; a treating solution source providing the substrate treating solution into the treating bath such that the substrates are immersed and treated in the substrate treating solution; and a bubble generation module connected to the treating bath and generating bubbles in the substrate treating solution by injecting gas.