THERMALLY CONDUCTIVE BOARD

A thermally conductive board includes a top metal foil, a bottom metal foil, and a thermally conductive layer laminated therebetween. The thermally conductive layer includes an electrically insulation matrix and a thermally conductive filler. The electrically insulation matrix includes a fluoropolym...

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Bibliographische Detailangaben
1. Verfasser:	LO, KUOANG
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	A thermally conductive board includes a top metal foil, a bottom metal foil, and a thermally conductive layer laminated therebetween. The thermally conductive layer includes an electrically insulation matrix and a thermally conductive filler. The electrically insulation matrix includes a fluoropolymer. The thermally conductive filler includes a glass fiber dispersed in the electrically insulation matrix. The glass fiber has a first dielectric constituent and a second dielectric constituent. The first dielectric constituent is a halogen. The total weight of the glass fiber is calculated as 100%, and the halogen accounts for at least 0.05%. The second dielectric constituent is a titanium family element. The total weight of the glass fiber is calculated as 100%, and the titanium family element accounts for at least 0.03%.