POLYAMIDE COMPOSITION

The present disclosure relates to thermoplastic resin compositions with improved impact strength, tensile modulus, and/or ductility, such as under low-temperature conditions. The present disclosure relates to articles formed therefrom, such as molded or extruded articles. The composition can include...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Fareed, Ali Syed, Lim, Chee Sern
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The present disclosure relates to thermoplastic resin compositions with improved impact strength, tensile modulus, and/or ductility, such as under low-temperature conditions. The present disclosure relates to articles formed therefrom, such as molded or extruded articles. The composition can include a condensation polyamide and a maleated polyolefin, such as ≥10 wt % to ≤50 wt % of a maleated polyolefin having a grafted maleic anhydride incorporation of ≥0.05 to ≤1.5 wt % based on total weight of the maleated polyolefin.