METHOD AND APPARATUS FOR ADJUSTING RECESS DEPTH OF A MOLD INSERT

A mold device includes a first mold side configured to receive a substrate in a cavity and to couple with a second mold side, the first mold side including a sidewall and a gate, wherein the substrate is recessed in the first mold side at a substrate recess depth of 2 mm or greater, and wherein the...

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Bibliographische Detailangaben
Hauptverfasser:	TOKARSKI, Zbigniew, DRAMMEH, Ahmed
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A mold device includes a first mold side configured to receive a substrate in a cavity and to couple with a second mold side, the first mold side including a sidewall and a gate, wherein the substrate is recessed in the first mold side at a substrate recess depth of 2 mm or greater, and wherein the substrate recess depth is a distance along the sidewall between a bottom of the gate and a surface of the substrate in a direction perpendicular to a line between the gate and a middle of the surface of the substrate, and wherein the bottom of the gate and a top of the sidewall are at distinct heights from the surface of the substrate.