PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

A printed circuit board includes an insulation layer having a first surface and a second surface which are opposite to each other, a first connection pad which is embedded in the insulation layer and has a surface recessed from the first surface of the insulation layer, a conductive layer which is l...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: Lee, Kyehwan
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:A printed circuit board includes an insulation layer having a first surface and a second surface which are opposite to each other, a first connection pad which is embedded in the insulation layer and has a surface recessed from the first surface of the insulation layer, a conductive layer which is located on the first connection pad and has a part embedded in the insulation layer and another part protruding from the first surface of the insulation layer, and a first solder resist layer which is located on the first surface of the insulation layer and has a surface which is at a level equal to or lower than a surface of the conductive layer.