HEATSINK PEDESTALS FOR THERMAL INTERFACE MATERIAL FILL

Mounting a heat sink to an electrical component by applying a thermal interface material on at least one of a surface of one of the electrical component and the heat sink, wherein the heat sink includes a heat pedestal including an interface surface with an apex having at least one curvature extendi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Bielick, James D, Lewis, Theron Lee, Yardley, Brent William, Stathakis, Karl, Larsen, Curtis Eugene
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Mounting a heat sink to an electrical component by applying a thermal interface material on at least one of a surface of one of the electrical component and the heat sink, wherein the heat sink includes a heat pedestal including an interface surface with an apex having at least one curvature extending therethrough. The heat sink contacts the electrical component through the thermal interface material. The apex of the interface surface is an element of the heat sink closest to the electrical component. The interface surface that includes the apex and the at least one curvature cause the thermal interface material to flow during the contacting so that any space between the heat sink and the electrical component is filled with thermal interface material and is substantially free of voids.