DESIGN, CONTROL, AND OPTIMIZATION OF PHOTOSENSITIVITY MODULATION ALONG PHOTORESIST FILM DEPTH

Embodiments disclosed herein include a method for forming a photoresist stack. In an embodiment, the method comprises forming a first photoresist layer over a substrate, where the first photoresist layer is formed with a first dry deposition process, and forming a second photoresist layer over the f...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HAO, RUIYING, SANCHEZ, MARTHA, DE CECCO, PAOLA, SACHAN, MADHUR, LEE, KWANGDUK D, BOZANO, LUISA
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Embodiments disclosed herein include a method for forming a photoresist stack. In an embodiment, the method comprises forming a first photoresist layer over a substrate, where the first photoresist layer is formed with a first dry deposition process, and forming a second photoresist layer over the first photoresist layer, where the second photoresist layer is formed with a second dry deposition process that is different than the first deposition process.