SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS

The disclosed substrate support includes a first region, a second region, a first electrode, and a second electrode. The first region is configured to hold a substrate placed thereon. The second region is provided to surround the first region and configured to hold an edge ring placed thereon. The f...

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Hauptverfasser: YAMAGUCHI, Shin, SUGAWARA, Tsuguto, SASAKI, Yasuharu, KOIZUMI, Katsuyuki, TAMURA, Hajime
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creator YAMAGUCHI, Shin
SUGAWARA, Tsuguto
SASAKI, Yasuharu
KOIZUMI, Katsuyuki
TAMURA, Hajime
description The disclosed substrate support includes a first region, a second region, a first electrode, and a second electrode. The first region is configured to hold a substrate placed thereon. The second region is provided to surround the first region and configured to hold an edge ring placed thereon. The first electrode is provided in the first region to receive a first electrical bias. The second electrode is provided in at least the second region to receive a second electrical bias. The second electrode extends below the first electrode to face the first electrode within the first region.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024194458A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024194458A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024194458A13</originalsourceid><addsrcrecordid>eNrjZDAMDnUKDglyDHFVCA4NCPAPClFw9HNRCPBxDPZ1VAgI8nd2DQ729HNXcAwIcAQqCw3mYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkYmhpYmJqYWjobGxKkCAB_zJ_M</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS</title><source>esp@cenet</source><creator>YAMAGUCHI, Shin ; SUGAWARA, Tsuguto ; SASAKI, Yasuharu ; KOIZUMI, Katsuyuki ; TAMURA, Hajime</creator><creatorcontrib>YAMAGUCHI, Shin ; SUGAWARA, Tsuguto ; SASAKI, Yasuharu ; KOIZUMI, Katsuyuki ; TAMURA, Hajime</creatorcontrib><description>The disclosed substrate support includes a first region, a second region, a first electrode, and a second electrode. The first region is configured to hold a substrate placed thereon. The second region is provided to surround the first region and configured to hold an edge ring placed thereon. The first electrode is provided in the first region to receive a first electrical bias. The second electrode is provided in at least the second region to receive a second electrical bias. The second electrode extends below the first electrode to face the first electrode within the first region.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERATION</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240613&amp;DB=EPODOC&amp;CC=US&amp;NR=2024194458A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240613&amp;DB=EPODOC&amp;CC=US&amp;NR=2024194458A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAMAGUCHI, Shin</creatorcontrib><creatorcontrib>SUGAWARA, Tsuguto</creatorcontrib><creatorcontrib>SASAKI, Yasuharu</creatorcontrib><creatorcontrib>KOIZUMI, Katsuyuki</creatorcontrib><creatorcontrib>TAMURA, Hajime</creatorcontrib><title>SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS</title><description>The disclosed substrate support includes a first region, a second region, a first electrode, and a second electrode. The first region is configured to hold a substrate placed thereon. The second region is provided to surround the first region and configured to hold an edge ring placed thereon. The first electrode is provided in the first region to receive a first electrical bias. The second electrode is provided in at least the second region to receive a second electrical bias. The second electrode extends below the first electrode to face the first electrode within the first region.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERATION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAMDnUKDglyDHFVCA4NCPAPClFw9HNRCPBxDPZ1VAgI8nd2DQ729HNXcAwIcAQqCw3mYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkYmhpYmJqYWjobGxKkCAB_zJ_M</recordid><startdate>20240613</startdate><enddate>20240613</enddate><creator>YAMAGUCHI, Shin</creator><creator>SUGAWARA, Tsuguto</creator><creator>SASAKI, Yasuharu</creator><creator>KOIZUMI, Katsuyuki</creator><creator>TAMURA, Hajime</creator><scope>EVB</scope></search><sort><creationdate>20240613</creationdate><title>SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS</title><author>YAMAGUCHI, Shin ; SUGAWARA, Tsuguto ; SASAKI, Yasuharu ; KOIZUMI, Katsuyuki ; TAMURA, Hajime</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024194458A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERATION</topic><toplevel>online_resources</toplevel><creatorcontrib>YAMAGUCHI, Shin</creatorcontrib><creatorcontrib>SUGAWARA, Tsuguto</creatorcontrib><creatorcontrib>SASAKI, Yasuharu</creatorcontrib><creatorcontrib>KOIZUMI, Katsuyuki</creatorcontrib><creatorcontrib>TAMURA, Hajime</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAMAGUCHI, Shin</au><au>SUGAWARA, Tsuguto</au><au>SASAKI, Yasuharu</au><au>KOIZUMI, Katsuyuki</au><au>TAMURA, Hajime</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS</title><date>2024-06-13</date><risdate>2024</risdate><abstract>The disclosed substrate support includes a first region, a second region, a first electrode, and a second electrode. The first region is configured to hold a substrate placed thereon. The second region is provided to surround the first region and configured to hold an edge ring placed thereon. The first electrode is provided in the first region to receive a first electrical bias. The second electrode is provided in at least the second region to receive a second electrical bias. The second electrode extends below the first electrode to face the first electrode within the first region.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
title SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-18T00%3A44%3A21IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YAMAGUCHI,%20Shin&rft.date=2024-06-13&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024194458A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true