Curable Composition

A resin composition comprising a polyol component, and a filler, and a use thereof are described. Such resin composition or a cured product thereof exhibits low adhesion force to a predetermined adherend while exhibiting high thermal conductivity without using an adhesion force adjusting component s...

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Bibliographische Detailangaben
Hauptverfasser:	Lee, Jeong Hyun, Kang, Yang Gu
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A resin composition comprising a polyol component, and a filler, and a use thereof are described. Such resin composition or a cured product thereof exhibits low adhesion force to a predetermined adherend while exhibiting high thermal conductivity without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized.