SYSTEMS AND METHODS FOR FORMING STUBLESS PLATED THROUGH HOLES HAVING WRAPPING STRUCTURES IN PRINTED CIRCUIT BOARDS

A multilayer structure for a printed wiring board (PWB) includes a plurality of insulating layers interleaved with a plurality of conductive layers including one or more inner conductive layers, a top conductive layer, and a bottom conductive layer. The multilayer structure also includes at least one through-hole through the plurality of insulating layers and the plurality of conductive layers. The multilayer structure also includes at least one secondary material layer formed on at least one inner conductive trace or a terminating land having a surface and an edge near one of the at least one through-hole, the at least one secondary material layer after being removed partially defining a recess that allows plating on both the edge and the surface of the at least one inner conductive trace or the terminating land. The at least one through-hole includes a first plated segment seamless connected to a second plated segment wrapped over the edge of the at least one inner conductive trace or terminating land and extending at least a portion of the surface of the at least one inner conductive trace or terminating land.