PACKAGE, SEMICONDUCTOR DEVICE, AND APPARATUS

A package includes a plurality of terminals, a mark portion, and a base plate. a mark for identification is provided on the mark portion. The plurality of terminals and the mark portion are provided on one surface of the base plate. A smooth portion, which is smoother than another portion between th...

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Bibliographische Detailangaben
Hauptverfasser:	KIMURA, IKUTO, MINAMI, YOSHIHIRO, NOTSU, KAZUYA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A package includes a plurality of terminals, a mark portion, and a base plate. a mark for identification is provided on the mark portion. The plurality of terminals and the mark portion are provided on one surface of the base plate. A smooth portion, which is smoother than another portion between the plurality of terminals and the mark portion, is provided on the one surface and between at least one terminal among the plurality of terminals and the mark portion.