PACKAGE WITH UNDERFILL CONTAINMENT BARRIER

PACKAGE WITH UNDERFILL CONTAINMENT BARRIER

An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material di...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ALUR, Siddharth K, VADLAMANI, Sai, DHALL, Ashish, CHAVALI, Sri Chaitra J, LEE, Kyu Oh, JAIN, Rahul, JEN, Wei-Lun K, MEHTA, Vipul V, MANEPALLI, Rahul N, ALUR, Amruthavalli P
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.