MICRO-LAYER CMP POLISHING SUBPAD

The polishing pad has a polymeric matrix, a polishing surface useful for polishing at least one of semiconductor, magnetic and optical substrates and a bottom surface; a porous subpad adhered to the bottom surface of the polishing pad. The porous subpad includes a nonporous microlayer for securing t...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Alsbaiee, Alaaeddin, Wang, Techun, Crevasse, Annette M, Wank, Andrew, Barton, Bryan E, Hou, Guanhua, Vasquez, Nestor A, McCormick, John R
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The polishing pad has a polymeric matrix, a polishing surface useful for polishing at least one of semiconductor, magnetic and optical substrates and a bottom surface; a porous subpad adhered to the bottom surface of the polishing pad. The porous subpad includes a nonporous microlayer for securing the polishing pad to the porous subpad. The porous polymer network contains i) a single layer of closed cell micropores adjacent the nonporous microlayer for transitioning compressive forces from the bottom surface of the polishing pad to the porous subpad; and ii) a multilayer of closed cell, open cell or a mixture of closed and open cell micropores adjacent the single layer of closed cell micropores.