MODIFIED COPPER SURFACE, HETEROAROMATIC SILANE COMPOUNDS AND THEIR USAGE FOR INCREASING ADHESION STRENGTH BETWEEN COPPER AND AN ORGANIC MATERIAL AND REDUCING HALO AND WEDGE VOID FORMATION

MODIFIED COPPER SURFACE, HETEROAROMATIC SILANE COMPOUNDS AND THEIR USAGE FOR INCREASING ADHESION STRENGTH BETWEEN COPPER AND AN ORGANIC MATERIAL AND REDUCING HALO AND WEDGE VOID FORMATION

The present invention relates to a method for increasing adhesion strength between a surface of a copper, a copper alloy or a copper oxide and a surface of an organic material.

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: THOMS, Martin, MICHALIK, Fabian, HAARMANN, Philipp, BELOVA-MAGRI, Valentina, KNAUP, Jan, ACKERMANN, Stefanie, LÜTZOW, Norbert, KÖNIGSMANN, Tatjana
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present invention relates to a method for increasing adhesion strength between a surface of a copper, a copper alloy or a copper oxide and a surface of an organic material.