ELECTRONIC DEVICE

An interposer including capacitors having a density greater than 700 nF/mm{circumflex over ( )}2. advantageously greater than 1 μF/mm{circumflex over ( )}2. the interposer being adapted to being bonded to a chip by hybrid bonding.

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Bibliographische Detailangaben
Hauptverfasser:	Charbonnier, Jean, Laviron, Cyrille, Lamy, Yann, Bourjot, Emilie
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An interposer including capacitors having a density greater than 700 nF/mm{circumflex over ( )}2. advantageously greater than 1 μF/mm{circumflex over ( )}2. the interposer being adapted to being bonded to a chip by hybrid bonding.