SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

A semiconductor module a metal base plate having a semiconductor unit including a semiconductor element, the metal base plate having an upper surface and a bottom surface opposite to each other and the semiconductor element being mounted on the upper surface, and a case surrounding a periphery of the semiconductor unit and being bonded to the upper surface of the metal base plate. The case includes a first positioning portion formed by a protrusion protruding a bottom of the case toward the metal base plate, and a second positioning portion formed by a hole or a cutout so as to at least partially overlap with the first positioning portion in a plan view of the semiconductor module. The metal base plate includes a first engagement portion formed by a hole or a cutout with which the first positioning portion is engageable.