APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

An apparatus for manufacturing semiconductor device includes a pickup apparatus. The pickup apparatus includes: a stage including a plurality of protruding portions disposed so as to face a back surface of a dicing sheet to which a semiconductor chip is attached; and a suction unit configured to vac...

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Bibliographische Detailangaben
Hauptverfasser:	TAKAKI, Yasushi, UENO, Masaki, YAMASHITA, Kinya
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An apparatus for manufacturing semiconductor device includes a pickup apparatus. The pickup apparatus includes: a stage including a plurality of protruding portions disposed so as to face a back surface of a dicing sheet to which a semiconductor chip is attached; and a suction unit configured to vacuum-suck a space between an outer frame, the dicing sheet, and the stage. The plurality of protruding portions includes a plurality of first protruding portions and a plurality of second protruding portions different in height or vertical elastic modulus from each other.