PROCESSING APPARATUS AND SUBSTRATE TRANSFER METHOD

PROCESSING APPARATUS AND SUBSTRATE TRANSFER METHOD

A processing apparatus according to an aspect of the present disclosure includes a pick configured to hold and transfer a substrate, a first suction pad disposed at a position in the pick where the first suction pad comes into contact with a concavely curved substrate, a second suction pad disposed...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KAGAMI, Fumito, ARAI, Kaori, OBIKANE, Tadashi
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A processing apparatus according to an aspect of the present disclosure includes a pick configured to hold and transfer a substrate, a first suction pad disposed at a position in the pick where the first suction pad comes into contact with a concavely curved substrate, a second suction pad disposed at a position in the pick where the second suction pad comes into contact with a convexly curved substrate, a pressure sensor configured to detect a pressure in a first suction path connected to the first suction pad and a pressure in a second suction path connected to the second suction pad, and a controller configured to control suction operations by the first suction pad and the second suction pad based on a detection value of the pressure sensor.