SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME

A semiconductor package includes a first structure, a second structure, a plurality of first connection members including SnBi; a plurality of second connection members including SAC (Sn, Ag and Cu). Each first connection member of the plurality of first connection members has a first surface and a...

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Bibliographische Detailangaben
Hauptverfasser:	PARK, YONG SUNG, LEE, JIHYUN, LEE, JUNHO, RYU, HANSUNG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A semiconductor package includes a first structure, a second structure, a plurality of first connection members including SnBi; a plurality of second connection members including SAC (Sn, Ag and Cu). Each first connection member of the plurality of first connection members has a first surface and a second surface opposite each other, and the first surface of each first connection member of the plurality of first connection members is bonded to the first structure. A third surface of each second connection member of a plurality of second connection members is bonded to a corresponding second surface of a respective first connection member, and for each second connection member, a fourth surface of the second connection member that is opposite the third surface of the second connection member is bonded to the second structure. The third surface of each second connection member is flat, and a diameter of each second connection member decreases in a direction receding from the third surface of each second connection member.