VERTICAL-TYPE LIGHT-EMITTING DIODE AND LIGHT-EMITTING DEVICE

The disclosure relates to the field of semiconductor manufacturing technology, and in particular to a vertical-type light-emitting diode, which includes a substrate, a semiconductor stack layer and an insulation implant layer. The semiconductor stack layer is disposed on the substrate, and the semiconductor stack layer includes the first semiconductor layer, the light-emitting layer and the second semiconductor layer that are sequentially stacked on the substrate. The insulation implant layer is formed in the semiconductor stack layer to divide the semiconductor stack layer into at least two individual dies. By forming the insulation implant layer in the semiconductor stack layer, it is possible to achieve small spacing between dies and allow them to be insulated from each other without the need to create trenches or use PI adhesive. It is possible to ensure the photoelectric quality of the vertical-type light-emitting diodes and make the surface of the vertical-type light-emitting diodes flatter.