IMAGE SENSOR MODULE

An image sensor module having an image sensor chip configured to convert light collected from an outside into an electric signal, a substrate on which the image sensor chip is installed, a bonding wire electrically connecting the image sensor chip and the substrate, an encapsulant for encapsulating...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHU, Kyungsung, SONG, In-Sang
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:An image sensor module having an image sensor chip configured to convert light collected from an outside into an electric signal, a substrate on which the image sensor chip is installed, a bonding wire electrically connecting the image sensor chip and the substrate, an encapsulant for encapsulating the bonding wire by surrounding the side part of the image sensor chip, and a housing having a lower part spaced apart from the encapsulant and bonded on the substrate, and an upper part having an opening through which an external light is incident to the image sensor chip and supported by the encapsulant.