ELECTRONIC DEVICE WITH COPPER AND OXIDE LAYERS IN CONTACT

ELECTRONIC DEVICE WITH COPPER AND OXIDE LAYERS IN CONTACT

The present description concerns a method of assembly of a first assembly layer comprising a first copper region at a first surface and of a second assembly layer comprising a second region made of oxide or of an oxidized metal at a second surface, wherein the first and second surfaces are assembled...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: FREY, Laurent, AYOUB, Bassel, LHOSTIS, Sandrine
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The present description concerns a method of assembly of a first assembly layer comprising a first copper region at a first surface and of a second assembly layer comprising a second region made of oxide or of an oxidized metal at a second surface, wherein the first and second surfaces are assembled by means of a hybrid bonding such that the entire first copper region is placed into contact with the oxide or the oxidized metal of the second region.