REDISTRIBUTION LAYERS IN A DIELECTRIC CAVITY TO ENABLE AN EMBEDDED COMPONENT

Architectures and processes for redistribution layers in a dielectric cavity to enable an embedded component in semiconductor packaging. The architectures pattern redistribution layers (RDL) over a thick seed and remove dielectric material from the RDL conductive contacts to create the dielectric cavity. The architectures enable 2-sided connections for embedded components in the dielectric cavity with minimal disruption to existing process infrastructure. Such an approach can be used not only for integration of photonic devices, but also for any semiconductor packaging requiring dual sided connection within a dielectric cavity.