FINGERPRINT SENSOR PACKAGE AND SMART CARD INCLUDING THE SAME

FINGERPRINT SENSOR PACKAGE AND SMART CARD INCLUDING THE SAME

A fingerprint sensor package, including a package substrate which includes a cavity; a sensing substrate on the package substrate, the sensing substrate comprising a first surface and a second surface opposite to each other; a controller chip on the first surface of the sensing substrate; and a mold...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Lee, Kwangjin, Choi, Inho, LIM, JAEHYUN, Moon, Hyunjong
Format: Patent
Sprache:eng
Schlagworte:
CALCULATING
COMPUTING
COUNTING
PHYSICS
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Beschreibung
Zusammenfassung:A fingerprint sensor package, including a package substrate which includes a cavity; a sensing substrate on the package substrate, the sensing substrate comprising a first surface and a second surface opposite to each other; a controller chip on the first surface of the sensing substrate; and a molding layer on the controller chip and the first surface of the sensing substrate, wherein the second surface of the sensing substrate is exposed by the cavity