SYSTEMS AND METHODS FOR TREATING A SUBSTRATE

Disclosed herein is a composition comprising a first lanthanide series metal, wherein the composition has a pH of less than 2.0 and is substantially free of peroxide. Also disclosed herein is a composition comprising a first lanthanide series metal and at least one of a second lanthanide series meta...

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Hauptverfasser: Brown-Tseng, Elizabeth Stephenie, Harris, Rachel Dory, Kumar, Kuldeep, McMillen, Mark William
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creator Brown-Tseng, Elizabeth Stephenie
Harris, Rachel Dory
Kumar, Kuldeep
McMillen, Mark William
description Disclosed herein is a composition comprising a first lanthanide series metal, wherein the composition has a pH of less than 2.0 and is substantially free of peroxide. Also disclosed herein is a composition comprising a first lanthanide series metal and at least one of a second lanthanide series metal, copper, an inorganic phosphate compound, an organophosphate compound, and an organophosphonate compound; wherein the composition is substantially free of peroxide. Also disclosed herein are systems and methods of treating a metal substrate. Also disclosed are substrates treated with the systems and methods.
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subjects CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
title SYSTEMS AND METHODS FOR TREATING A SUBSTRATE
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