SYSTEMS AND METHODS FOR TREATING A SUBSTRATE

Disclosed herein is a composition comprising a first lanthanide series metal, wherein the composition has a pH of less than 2.0 and is substantially free of peroxide. Also disclosed herein is a composition comprising a first lanthanide series metal and at least one of a second lanthanide series meta...

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Bibliographische Detailangaben
Hauptverfasser: Brown-Tseng, Elizabeth Stephenie, Harris, Rachel Dory, Kumar, Kuldeep, McMillen, Mark William
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Disclosed herein is a composition comprising a first lanthanide series metal, wherein the composition has a pH of less than 2.0 and is substantially free of peroxide. Also disclosed herein is a composition comprising a first lanthanide series metal and at least one of a second lanthanide series metal, copper, an inorganic phosphate compound, an organophosphate compound, and an organophosphonate compound; wherein the composition is substantially free of peroxide. Also disclosed herein are systems and methods of treating a metal substrate. Also disclosed are substrates treated with the systems and methods.