SUBSTRATE TREATING SOLUTION, AND USING THE SAME, METHOD FOR MANUFACTURING SUBSTRATE AND METHOD FOR MANUFACTURING DEVICE

[Problem] To provide a substrate treating solution. [Means for Solution] The substrate treating solution comprises a polymer (A) and a solvent (B), wherein the solvent (B) comprises water (B-1); the polymer (A) comprises an acidic polymer (A-1) having a pKa (H2O) of −10 to 8 or a basic polymer (A-2)...

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Bibliographische Detailangaben
Hauptverfasser: SEKITO, Takashi, NAGAHARA, Tatsuro
Format: Patent
Sprache:eng
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Zusammenfassung:[Problem] To provide a substrate treating solution. [Means for Solution] The substrate treating solution comprises a polymer (A) and a solvent (B), wherein the solvent (B) comprises water (B-1); the polymer (A) comprises an acidic polymer (A-1) having a pKa (H2O) of −10 to 8 or a basic polymer (A-2) whose conjugate acid has a pKa (H2O) of 6 to 14; the content of the polymer (A) is 0.5 to 15 mass % based on the total mass of the substrate treating solution; the content of the solvent (B) is 70 to 99.5 mass % based on the total mass of the substrate treating solution; and the content of water (B-1) is 80 to 100 mass % based on the total mass of the solvent (B).