SUBSTRATE SUPPORTING DEVICE, A SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND A SUBSTRATE PROCESSING METHOD USING THE SAME

SUBSTRATE SUPPORTING DEVICE, A SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND A SUBSTRATE PROCESSING METHOD USING THE SAME

A substrate supporting device may include a cooling plate including a cooling hole, a thermal-insulation plate on the cooling plate, and a chucking plate placed on the thermal-insulation plate. The chucking plate may include a heater. The thermal-insulation plate may include an adiabatic space, whic...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIM, Seungbin, YEO, Dongyun, KIM, Juho, MIN, Heewon, KANG, Songyun, YOON, Kuihyun, KWON, Youngrok
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
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Beschreibung
Zusammenfassung:A substrate supporting device may include a cooling plate including a cooling hole, a thermal-insulation plate on the cooling plate, and a chucking plate placed on the thermal-insulation plate. The chucking plate may include a heater. The thermal-insulation plate may include an adiabatic space, which is recessed from a top surface of the thermal-insulation plate by a depth in a downward direction. The cooling plate may include a connection hole, which vertically extends and is connected to the adiabatic space.