WIRE BONDING DEFECT DETECTION APPARATUS AND OPERATION METHOD THEREOF

An apparatus and method are disclosed for detecting a bonding defect occurring during an ultrasonic wire bonding process between a battery cell and a busbar connected to each other by ultrasonic wire bonding. A bonding parameter collector, coupled to an ultrasonic wire bonding machine, may collect u...

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Bibliographische Detailangaben
1. Verfasser:	CHOI, Jee Hoon
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MACHINE TOOLS MEASURING METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICS PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY SOLDERING OR UNSOLDERING TESTING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	An apparatus and method are disclosed for detecting a bonding defect occurring during an ultrasonic wire bonding process between a battery cell and a busbar connected to each other by ultrasonic wire bonding. A bonding parameter collector, coupled to an ultrasonic wire bonding machine, may collect ultrasonic bonding parameters continuously during the ultrasonic wire bonding process, machine learning training may be performed by a convolutional neural network, and a bonding defect may be detected based thereon.