NANO-TWINNED ULTRA-THIN METALLIC FILM STRUCTURE AND METHODS FOR FORMING THE SAME

A nano-twinned ultra-thin metallic film structure is provided. The nano-twinned ultra-thin metallic film structure includes a substrate and a nano-twinned metallic thin film on the surface of the substrate. The nano-twinned metallic thin film has a thickness of 0.5 μm to 3 μm and includes silver, co...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	CHUANG, Chien-Hsun
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A nano-twinned ultra-thin metallic film structure is provided. The nano-twinned ultra-thin metallic film structure includes a substrate and a nano-twinned metallic thin film on the surface of the substrate. The nano-twinned metallic thin film has a thickness of 0.5 μm to 3 μm and includes silver, copper, gold, palladium or nickel. The nano-twinned metallic thin film has a transition layer near the substrate and a twin layer away from the substrate. The twin layer accounts for at least 70% of the thickness of the nano-twinned metallic thin film and has parallel-arranged twin boundaries. The parallel-arranged twin boundaries include more than 50% (111) crystal orientation. The nano-twinned ultra-thin metallic film structure is formed by activating the substrate surface using ion beam bombardment, followed by performing a sputtering process on the activated substrate surface with a substrate bias.