SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

A substrate processing apparatus includes a substrate holding unit, a rotation driving unit, a first rotational ring, a second rotational ring, and a first nozzle. The substrate holding unit includes a base plate and a plurality of gripping units that grips a peripheral edge of a substrate, and horizontally holds the substrate spaced apart from the base plate by the gripping units. The rotation driving unit rotates the substrate holding unit. The first rotational ring surrounds a peripheral edge of a lower surface of the substrate and rotates together with the substrate holding unit. The second rotational ring is provided outside the first rotational ring, surrounds a peripheral edge of an upper surface of the substrate, and rotates together with the substrate holding unit. The first nozzle ejects a cleaning liquid from above an entrance of a rotational flow path toward the entrance of the rotational flow path.