SEMICONDUCTOR DEVICE

A semiconductor device includes a wiring substrate including a plurality of wiring layers, and a semiconductor chip including a first analog circuit. A power supply potential pattern capable of supplying a first power supply potential to the first analog circuit and a reference potential pattern capable of supplying a first reference potential to the first analog circuit are electrically connected with the first analog circuit. The power supply potential pattern is provided in a first wiring layer which is the nearest to a lower surface of the wiring substrate among the plurality of wiring layers. The reference potential pattern is provided in a second wiring layer which is the next nearest to the lower surface after the first wiring layer. The power supply potential pattern and the reference potential pattern extend in the same direction as each other while mutually overlapping with each other in transparent plan view.