BONDED ABRASIVE WITH LOW WETTING BOND MATERIAL

BONDED ABRASIVE WITH LOW WETTING BOND MATERIAL

The subject application relates to bonded abrasive with low wetting bond material. An abrasive article including a bonded abrasive body having a particular MOR/EMOD ratio associated with a particular bond vol %. The body also can include a) an average Bond Post Area (BPA) of not greater than microns...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LUO, Zhenyu, WANG, Qing, LIN, Guangyong, LU, Lu, SARANGI, Nilanjan
Format: Patent
Sprache:eng
Schlagworte:
GRINDING
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Beschreibung
Zusammenfassung:The subject application relates to bonded abrasive with low wetting bond material. An abrasive article including a bonded abrasive body having a particular MOR/EMOD ratio associated with a particular bond vol %. The body also can include a) an average Bond Post Area (BPA) of not greater than microns2; b) an average Bond Post Count (BPC) of at least 140 per 1536 mm2; c) an average bond wetting radius of at least 30/microns; or d) a combination of a) and b).