DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINABLE CIRCUITS

DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINABLE CIRCUITS

Devices, systems, and methods for making and using highly sustainable circuit assemblies are disclosed herein. In various aspects, the highly sustainable circuit assembly includes a substrate layer; and a pattern of contact points supported by the substrate layer. The pattern of contact points can b...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Nelson, Katherine M, Martinez, Jesse Michael, Neumann, Taylor V, Kruskopf, Mark S, Clarke, Austin Michael, Carbo, JR., Jorge E, Desabathina, Sai Srinivas, Kinzel, Charles J, Hopkins, Michael Adventure, Rivera, Trevor Antonio, Wallans, Michael Jasper, Ronay, Mark William
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:Devices, systems, and methods for making and using highly sustainable circuit assemblies are disclosed herein. In various aspects, the highly sustainable circuit assembly includes a substrate layer; and a pattern of contact points supported by the substrate layer. The pattern of contact points can be configured to correspond to at least one terminal of an electrical component. The pattern of contact points can include a deformable conductive material. The deformable conductive material can be a non-hazardous, readily reclaimable, readily recyclable material.