LEAD FRAME AND MANUFACTURING METHOD THEREOF

LEAD FRAME AND MANUFACTURING METHOD THEREOF

A lead frame includes a plurality of lead portions. At least a part of an upper surface of the lead portion and a sidewall surface of the lead portion is a rough surface having been subjected to roughening treatment. A value of a* in a CIELab color space of the rough surface is within a range from 1...

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Bibliographische Detailangaben
Hauptverfasser: YAMADA, Masahiro, SEKI, Kentarou, SHINOZAKI, Kazuhiro, NAGATA, Masahiro, OKUYAMA, Daisuke, OOUCHI, Kazunori, MATSUI, Hideto, HATSUTA, Chiaki
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A lead frame includes a plurality of lead portions. At least a part of an upper surface of the lead portion and a sidewall surface of the lead portion is a rough surface having been subjected to roughening treatment. A value of a* in a CIELab color space of the rough surface is within a range from 12 to 19, and a value of b* is within a range from 12 to 17.