SEMICONDUCTOR PACKAGE

A semiconductor package includes a first redistribution substrate, a first semiconductor chip on the first redistribution substrate, a heat dissipation layer on the first semiconductor chip and in contact with an upper surface of the first semiconductor chip, a second redistribution substrate on the heat dissipation layer, a molding layer surrounding the first semiconductor chip and the heat dissipation layer between the first redistribution substrate and the second redistribution substrate, through electrodes vertically penetrating the molding layer and electrically connecting the first redistribution substrate and the second redistribution substrate, the through electrodes being spaced apart from the first semiconductor chip and the heat dissipation layer, and dummy patterns vertically penetrating the molding layer and in contact with a side surface of the first semiconductor chip and a side surface of the heat dissipation layer. The first redistribution substrate includes a first insulating layer, first wiring patterns in the first insulating layer and electrically connecting the first semiconductor chip and the through electrodes, and second wiring patterns in the first insulating layer, electrically connected to the dummy patterns, and electrically insulated from the first wiring patterns.