PROCESS FLUID TREATMENT APPARATUS, AND WAFER CLEANING APPARATUS AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING SAME

PROCESS FLUID TREATMENT APPARATUS, AND WAFER CLEANING APPARATUS AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING SAME

Proposed are a process fluid treatment apparatus capable of decomposing ozone in a process fluid more effectively, and a wafer cleaning apparatus and semiconductor manufacturing equipment including the same. The process fluid treatment apparatus treats the process fluid used for cleaning a wafer in...

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Bibliographische Detailangaben
Hauptverfasser: CHOI, Young Seop, JEON, Myung A, YANG, Boo Seok, LEE, Bok Kyu, LEE, Dong Uk
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
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Beschreibung
Zusammenfassung:Proposed are a process fluid treatment apparatus capable of decomposing ozone in a process fluid more effectively, and a wafer cleaning apparatus and semiconductor manufacturing equipment including the same. The process fluid treatment apparatus treats the process fluid used for cleaning a wafer in the semiconductor manufacturing equipment, and includes a housing having an inner space configured to contain the process fluid, a spray nozzle configured to spray the process fluid containing ozone into the inner space in the form of mist, and a nozzle heater configured to heat the process fluid passing through the spray nozzle.