METHODS AND DEVICES RELATED TO RADIO FREQUENCY DEVICES

A device includes a thinned semiconductor substrate having a first side and a second side opposite to the first side; and at least one radio frequency device at the first side, wherein the second side of the thinned semiconductor substrate is processed to reduce leakage currents or to improve a radi...

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Bibliographische Detailangaben
Hauptverfasser: Feick, Henning, Cattaneo, Andrea, Taddiken, Hans, Seidel, Uwe, Solomko, Valentyn, Heiss, Dominik, Butschkow, Christian, Kadow, Christoph, Steltenpohl, Anton
Format: Patent
Sprache:eng
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Zusammenfassung:A device includes a thinned semiconductor substrate having a first side and a second side opposite to the first side; and at least one radio frequency device at the first side, wherein the second side of the thinned semiconductor substrate is processed to reduce leakage currents or to improve a radio frequency linearity of the at least one radio frequency device through Bosch etchin